Hello all,
I know that this is slightly off-topic. But if someone could help...
I am stuck with the BGA solder inspection of an IC having the following physical specification in terms of Soldering.
Size: 2.5sq.cm
Lead type: BGA
Ball Pitch: 0.65mm
Pin Count: 1031
The assembly was done using Lead Free Technology.
X-ray inspection failed miserably, since the IC has a metal cap meant for Thermal Dissipation.
If anyone has industrial level experience in BGA's, their guidance will be helpful.
Thanks in Advance,
VU3AUZ, Allen Antony
Chennai/Blore
+91-94473 19727
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